Advanced semiconductor manufacturing co., LTD., a subsidiary of Deca Technologies, announced an agreement together, by the ase to Deca to invest $60 million, and engineering, will receive Deca M series? The fan out wafer level packaging (FOWLP) technology and the process of authorization. As part of the agreement, ase to jointly develop M series and Deca fan out manufacturing process, and will adopt this technology improve the output of chip scale packaging. The technology can satisfy the portable Internet of things (IoT) applications and smartphone to more small size and low power requirements. Deca method was developed by using SunPower automatic line (autoline) technology to reduce the cost, compression production cycle.
Plath semiconductor company CEO and Deca Technologies, chairman of the board T.J. Rodgers said: "the plath has on its own chip experience Deca M series technical efficiency, customers also benefit from it. The moonlight on the day when the investment make the Deca M series technology has a strong backing, the fan to the wafer level packaging technology of mass production. The value of the deal proof the Deca, at the same time that the plath continued investment in startups, make it become our new strategy is a member of the technical department of success."
Moore's law for semiconductor shrinking in size Accommodate more functions, the unexpected effects for semiconductor packaging industries. At present, the technology of the advanced silicon chip is too small, so can't use the traditional wafer level chip packaging (WLCSP) technology will solder ball placed all input and output to the chip surface. M series of Deca FOWLP method is used to solve the problem. This method is to small chip embedded in a larger plastic chip, and divide the CSP solder ball to cloth on the original and extended plastic chip. M series adopts Deca proprietary "adaptability design" (the Adaptive Patterning?) Technology, can track the plastic package of redistributing the arrangement of each of the silicon IC, achieve the leading manufacturability. Ase confirmed the FOWLP M series is feasible and effective by large scale production solution.
Deca Technologies CEO Chris Seams, said: "smart phones and the Internet of things in emerging markets to improve performance and decrease the size of packaging requirements more and more intense, the industry has been looking for truly manufacturability FOWLP technology. Deca ase choice designed the M series technology to meet this challenge, we are deeply gratified. With the help of ase broad customer base and world-class production expertise, our FOWLP process will be able to realize the mass production."
Deca fan out wafer level packaging technology will become one member of the day the moonlight advanced packaging solutions, to provide customers with more choices, to maximize meet the demand of IC design. Dr Sun moon group COO tien wu said: "this day's announcement is an important milestone in the history of the moonlight FOWLP roadmap, show ase continuously together with key partners to build a complete manufacturing ecological system, the determination of the leading industry. The introduction of Deca M series and adaptability design technology and production technology, will make the ase has the ability to provide customers with the mature FOWLP solution. Due to the efficiency of the scheme is based on large panel process, thus has the very high cost performance."
Ase investment need to get approve or agree with the parties, including but not limited to Taiwan's government for approval.
