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Vice minister of ministry meeting with the vice President of IBM Strengthening the cooperation of the high-end chip
Time£º2016/4/22 10:06:34

On April 20, learned from the ministry that on April 19, the deputy minister of industry and information technology, bosom into peng met with IBM's senior vice President of global TomRosamilia, on further strengthening and other cooperation in the field of high-end chip Power exchange of views.

Bosom into peng to IBM and China industry in areas such as integrated circuit's positive cooperation has praised, said China's integrated circuit wide development space of market, welcome to actively participate in IBM "made in China 2025" and "Internet +" plan of action, etc. The implementation of the strategy process, with a more open attitude to further deepen and industry of China and in the field of technology and talent cultivation in colleges and universities cooperation, jointly build good industry ecological system.