Advanced manufacturing processes, TSMC firing again, this season is divided by 16 nm process heavy cast slice apple A10 processor, as well as mediatek and qualcomm mobile phone chips such as low order customers, provide more cost effectiveness of 16 nm FFC process, and import the TSMC has been planned for some time integrated type fan out encapsulation (InFO) foreign orders, the show from the design, manufacture to the later period of the powerful integrated packaging.

No single TSMC client comment. Foreign investment estimation, TSMC processor A10 for apple this year shipment 200000 pieces on the 12-inch wafer, and revenue contribution is five times that of last year, revenue forecast third quarter TSMC merger JiZeng rate can reach 15%, growth momentum is quite strong.

However, due to 206 south of wafer capacity tiebreaker after earthquake has come to an end, the market, apple will next season 2 related components orders, kgi securities issued by the earlier report, forecast apple iPhone sales of about 190 million to 210 million units this year, less than forecast of 210 million to 230 million, the industry focus on whether it will impact production scheduling, TSMC is legal person observe TSMC said on April 14 method will be an important indicator.

In addition, the new Taiwan dollar appreciation pressure is still in, whether impact TSMC gross margin trend, is also a market focus.

Since this season, TSMC, began to offer more cost advantage of 16 nm FFC process, cater to qualcomm, haisi and mediatek storm low order the mobile phone market. TSMC 16 nm process this year, is on a roll, winner-take-all high, medium and low mobile phone orders, become a biggest winner semiconductor factory.

TSMC forecast, this year 16 nm rapidly pull litre capacity, world market share of nanometer process in 16/14, than last year's 50%, up to as high as 70%, and foe of samsung's gap.