As the links on the Internet the rapid growth of the mobile device, and the Internet of things (IoT) the rise of the sensor, microelectromechanical (MEMS) devices, analog power IC, IC and other semiconductor components market demand more and more big, also make the previous 8 inches (200 mm) has been declining wafer production capacity to ascend.

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International semiconductor equipment materials industry association (SEMI) said the global 8 inch wafer production peaked in 2007, began to slip, and reached its lowest point in 2009. Subsequent years although capacity slightly rebounded, but are low in 2006, the average monthly investment (WSPM) 5.47 million pills.

, according to a research institute IC Insights data in 2009 ~ 2013 global shut down 72 fabs, 8 inch wafer plant accounted for 25%; 6 inches (40%); 12 inches (11%).

Wave, however, the latest data show that the Internet of things is for 8 inches fabs to inject new vitality. Is expected in 2015 ~ 2018, the global eight-inch wafers per month new cast slice volume is expected to reach 300000 ~ 300000. In 2018, the global average 8 inch wafer for volume will reach 5.43 million pieces per month, behind only 5.47 million pieces of 2% in 2006.

Although the 2018 global 8 inch wafer production capacity is expected to return to 2006 levels, but on the wafer using of present a tremendous change. Discrete devices, power supply IC and micro-electro-mechanical components of growth will be rapid growth, from 4% in 2006, rising to 10% in 2018. Analog IC will also because by 6 inches (150 mm) to 8 inch wafer to wafer transfer production, accounted for up to 14%.

Wafer generation industry is in the power IC, display driver IC and CMOS image sensor, microcontroller (MCU), micro-electro-mechanical, and only need 90 nanotechnology can other electronic components, driven by demand for production to one of the most. Proportion is as high as 43% in 2018, 29% in 2006, increased by 14%.

As for storage products, because most will be transferred to the by 12 inches (300 mm) wafer production, therefore the proportion in the 8 inch wafer, from 32% in 2006, a sharp decline to 2% in 2018. The same phenomenon also occurs in microprocessor with logic IC components, accounted for from 27% in 2006, falling to 21% in 2018.