Apple (Apple) in 2016 second half is expected to launch a new iPhone 7 (influences &styles, firms see a new generation of the iPhone will be fully change greatly, including mobile phones internal and appearance of new design and application, will drive a new wave of product design, leading to a new generation of the iPhone screens business chip suppliers, recently are eating into Taiwan wafer foundry and comprehensive testing industry capacity, 2, 3 season will be a new generation of the iPhone is one of the main benefit from the manufacturer.
Recent include Cirrus Logic and the DE bono (ADI) chip suppliers, such as a sharp reservation of dispute wafer foundry and testing capacity, its Type - C, optical zoom, and prevent the IC solutions such as hand shake, have the opportunity to fully for apple new generation iPhone business opportunities, and began eating into Taiwan wafer foundry and testing industry capacity 2, 3 quarter.
Companies disclosed Cirrus Logic synchronous chip integrated audio transmission function of the Type C, a new generation of the iPhone is apple instead of 3.5 mm audio interface secret weapon, it will make a new generation of the iPhone in the dustproof, anti-fouling, waterproof function design to the next level, at the same time can save a lot of cost.
As for a new generation of iPhone series possible double lens function, will be effective to upgrade the existing optical zoom, add new optical hand shock resistant, related to the motor drive IC, sensing devices and analog IC solutions business opportunities is quite attractive, driven ahead of the layout of dispute quite a lot of IC design industry at home and abroad related chip products, but the industry expect apple for a new generation of iPhone series double lens design architecture, should give priority to continue to cooperate with ADI chip research and development team.
It is important to note that although the industry speculation constantly TSMC 16 nai metric process can be added apple a new generation of 64 bit processor A10 orders, but recent TSMC 16 nai metric cheng continued to expand capacity, combined with the integration of internal innovation type fan out wafer level packaging (InFO) capacity is synchronous, the industry expected TSMC 16 nai metric on apple A10 processor orders for cheng, should be in an impregnable position.
In addition, in the next generation of TSMC continues to top 10 nai metric technology, technology leading position, plus the previous 14 nanometers and 16 metric technology advantages and disadvantages of noise has completely faded, TSMC obvious virtuosi rivals, and closer partnership with the customers.
In the face of apple's new generation iPhone overhaul menacing, Taiwan is related to the semiconductor supply chain industry actively beat layout, has become the focus of the industry, card industry supply chain to a new wave of opportunity, 2016 results will be relatively strong growth momentum.
