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Microchip to introduce multi-touch integration of silicon and 3 d gesture technology module
Time£º2016/1/18 9:42:04

Microchip technology companies in the United States is the world's leading SCM, mixed signal simulator, and flash patent solution suppliers, has announced and silicon technology co., LTD (SiS) together bring customers complete projected capacitive touch (PCAP) and 3 d gesture interface module, to speed up the development speed and reduce the cost. With these modules, developers can more easily use microchip GestIC multi-touch technology to design and 3 d gesture to show the application. GestIC technology can realize the furthest away from the screen surface hand tracking within 20 cm. Gesture is the advantage of strong commonality, health and easy to learn. Without precise hand-eye coordination, the use of gestures can also greatly improve the safety.

Microchip developed GestIC technology, make its can be conveniently and multi-touch PCAP controller together. Is currently on the market at the lowest cost 3 d gesture technology.

In addition, the structure of GestIC sensor using standard materials and production methods, such as glass or metal sheet covering the indium tin oxide (ITO), metal mesh and the conductive ink. Is the world's first new SiS module for display applications, integrated the technologies of PCAP 2 d and 3 d gesture of complete solutions.

SiS in the PC chipset, eMMC, eMCP and projected capacitive touch solutions, and other fields has 30 years of rich experience and professional knowledge. In the cooperation with Microchip, SiS will be in charge of the electronic development and sensor integration. Cooperation will help to speed up the pace of product development module, suitable for automotive and consumer industries.