Semiconductor market research firm IC Insights published in 2015, the whole chip factory production capacity, top ten little changed, only, Romania's switch (fab) and Intel's ranking, the separated 6, 7.

As of December 31, samsung monthly capacity equivalent to 2.534 million pieces of 2.534 million mm (8 inches) silicon wafer, the market share of 15.5% high on the world's first, most of its application in the production of DRAM and flash memory capacity.

Taiwan has two fabs squeeze into the top 10, respectively. (2) TSMC and umc (8), including TSMC wafer production capacity per month to 1.891 million, a 14% increase in 2014, samsung's 8% higher growth, make the gap from 2013 in 688000 to close to 643000 pieces. TSMC city share to 11.6% in 2014, umc is 3.4%.

Micron, Toshiba/SanDisk and SK hynix separated 3-5, market share by 9.8%, 8.2% and 9.8%.

Reported that Intel slipped because of its China factory (Fab 68) ongoing reconstruction, Intel announced in October 2015, will see China factory into the next generation of memory chips