At present, the electronic chip development towards more and more complex, and the traditional IC integrated device and metal pipe shell packaging will be difficult. MEMS sensor, for example, in order to improve its performance, often need to increase the thickness of the moving mass, using the traditional IC integrated device packaging technology and standards at home and abroad of LCC (no pin chip carrier) encapsulation shell cavity depth often cannot meet the requirements of the thickness of the MEMS, greatly due to the complexity of micro encapsulation and assembly process, and the whole area of the chip is very big, increased costs, conducive to mass production.

Xue Xu of geology and geophysics, Chinese academy of sciences institute of engineers and others to comb type MEMS accelerometer for typical example, invented a particularly suitable for MEMS MEMS inertial sensor integrated encapsulation method, and has obtained the national invention patent license (patent name: a MEMS sensor encapsulation structure and its encapsulation method; the inventor: Xue Xu, Guo Shichao; patent no. : ZL 2014 1, 0183524.9). Aiming at the shortcomings of the existing technology, they provide a kind of easy to expand according to need is the base of the hierarchy, and wire can be layered setting in the base, can solve the problem of linear difficult. In addition, they also provide a way to lower stress and pressure tightness good packaging structure, taking the low temperature low temperature encapsulation technology of parallel seam welding. MEMS and bonding technology of base and material matching, and the temperature sensor and MCU processor effective arrangement, from material stress, compensation, real-time temperature calibration algorithm solves the MEMS inertial sensor especially the temperature coefficient of MEMS acceleration sensor, such as temperature hysteresis big difficult problems, improve the production efficiency, reduce the cost.

The invention from the bias stability, temperature characteristic and engineering solved the difficult problem of MEMS, several aspects, such as the technology has been in the research is carried out on the prototype and product small batch trial production, has achieved good results, preliminary to engineering and production capacity, has a certain application prospect.