Semiconductor equipment industry, according to samsung import 7 nm process progress than expected, may not like the original planning production next year, by contrast, TSMC 7 nm 1 next year seasons risk trial-produce, yield within the schedule given to go forward, is scheduled to cast slice, for the fourth season next year contributed revenue since 2018.

TSMC within 7 nm as with Intel and samsung is the most important battle, especially Intel has and ARM (ARM) signed the authorization agreement, will use the ARM architecture, in 10 nm process provide OEM service, and TSMC, that TSMC can't afford more.

Samsung in A10 apple processor OEM orders are all TSMC after eat, decided to come back, will be the center of gravity in 7 nm, and decided in advance in 7 nm import department Moore (ASML) developed by love the latest EUV (extreme ultraviolet lithography equipment, used in semiconductor production processes.

Samsung original forecast, in the first half of next year furnish complete and 7 nm, however, semiconductor equipment maker, according to samsung 7 nm development badly behind schedule, meet the list next year difficulty is very high.

, by contrast, with 10 nm TSMC process control apple, mediatek and haisi customers the advantage of import, and 7 nm in solid-state reaction speed and the function and performance, such as more than 10 nm is superior, let TSMC a line of big customer, including the original in samsung group of qualcomm, will also return big TSMC, highlights from 7 nm TSMC in international companies.

TSMC executive together and mark liu, general manager of previously revealed, to 10 nm TSMC process this season to season 1 next year is expected to mass production; 7 nm due seasons 1 risky trial production next year. TSMC forecast, 7 nm contribute revenue will be in the first three months of 2018, is expected to lead global became the first 7 nm process of foundry fabs.

In addition, 5 nm TSMC process such as tea research and development, also as fire and compiled nearly 400 people in research and development team, in more advanced 3 nm process research and development, and the 1 nm process, show after overtaking Intel TSMC, widening leading purpose of the distance.