Experience of the international financial crisis of 2008, Germany and Japan have put forward the "4.0", "white paper" manufacturing and other manufacturing industry transformation plan, the state council has also put forward the "made in China 2025", expected to use the next 10 years, from "manufacturing power" to "manufacturing power", and put forward 2020 mainland IC domestic demand market of self-making ratio of 40%, 70% of the 2025 target, under the policy, also prompted TSMC and umc, Intel (Intel), Samsung Electronics, Samsung Electronics, GlobalFoundries in succession to the mainland to set up the wafer foundry, NAND Flash and other 12 inches fabs.

Mainland whether its semiconductor factory production capacity, market demand or heat, is in 55 nm and 40 nm process are very mature and strong, for the overall strategic layout, 28 nm is still regarded as a next step must attack prey.

Because of this, in cooperation with Qualcomm, Qualcomm 28 nm process, Poly real - Sion process has production, continue to force me HKMG process; Second production 28 nm process LiWei electronic Chinese local semiconductor factory is China, cooperate with mediatek, established production schedule is the end of 2016, though not sure whether it will, because the comparison umc, in the past progress is deferred for many years, but China LiWei into 28 nm is sooner or later, and the second of its 12 inches fabs also is expected to mass production in 2018, from 28 nm cuts.

From core /  LiWei qualcomm, China /  mediatek such collocation and combination, one tied a IC design companies, to 28 nm process drawing, can see behind a certain political implications.

However, after 28 nm process the level to go down again, could not so easily! After 28 nm TSMC is Apple (Apple) tailor-made 20 nm process, but a transition process, the comprehensive competitiveness of the real is 16 nm, is also the first TSMC FinFET process technology. At present not only production, also introduced more cost competitive 16 FFC process, at the end of the year to 10 nanometers, apple, haisi, mediatek, the spirit, and other large customers here in an all-round way.

In addition to 28 nm TSMC into the fifth year, also maintain more than 70% of the city, the rate of other semiconductor factory to conquer the process alone, eat a lot of hell, umc 28 nm is entered into production in 2013, a year is not lack of customer support, but also to the large volume Cheng Cai 28 nm HKMG system started in 2016.

With sample area, the core of 28 nm although qualcomm vigorously support, but also is later than expected time of mass production point for a long time, now only into the poly real - Sion, still waiting for high-order HKMG process really a lot, which will pursue the steps of TSMC is not easy, and now mainland TSMC go directly to nanjing to set up the most advanced nanometer line 16, you can feed the local chip market.

Below the 28 nm process, the mainland semiconductor factory will go? At present in the core has been exposed to and huawei, qualcomm, Belgium microelectronics (imec) company jointly established "smic IC research and development of new technology (Shanghai) co., LTD.", to develop the next generation of CMOS logic process, to research and development of 14 nm process from generation to generation as a beginning, control of the company held by smic, is expected in 2020 production of 14 nm process.

But this seemingly beautiful blueprint, and cast with the strength of the joint venture company, whether it will make in mass production in 2020, was born the first mainland local since the research of homemade 14 nanometer semiconductor processing chip? The outside world is still have doubts.

Most companies think, FinFET process technical difficulty is too high, 28 nm is delayed for many years, 14 nm process even 2020 production as scheduled, TSMC is already 5 nm process, when 14 nm is no longer the so-called advanced process.

The other, have the ability to make 14 nm process chip, can with a large number of shipment to the customer, this is a question of different levels, the former is declared, the latter has substantial revenue and earnings, one is face, another is the face and lining. In the same way, on 28 nm process, there are 28 nm process technology, with 28 nm level of more than 20% of revenue, is two levels, and between the two may need to spend several years.

Another trend is observed, semiconductor factory in mainland China over the years began to push the FD - SOI technology, including samsung, GlobalFoundries, stmicroelectronics, however, means that the semiconductor processes have now gone into reverse.

Under 28 nm process, TSMC, Intel and other companies have choose FinFET process, because the FD - SOI technology compared with FinFET technology, the same area of low density of transistors, and the efficiency is no match, but the barriers to entry is low, from internal TSMC did FD - SOI, but in the end still choose leading FinFET technology.

However, recent FD - SOI technology semiconductor popular in mainland China, is also can be regarded as another choice other than FinFET technology. Otherwise, the mill into a FinFET technology must be at least 3 ~ 5 years, and can effective and back to this problem, and not every a semiconductor factory has resources can like smic, to find in China for such a line of higher-ups this dream team.

Change a point of view, the next 3 to 5 years domestic chip demand from the mainland, with 28 nm process actually already very full, whether the Internet of things, car networking, the family, the wisdom, wisdom, manufacturing city, from 55, 40 nano to 28 nm process, sufficient to meet the demand of various related chips, even eat all over the domestic market, and complete the IC 2020 mainland domestic market self-making ratio was 40%, and the mainland semiconductor need so quickly into the FinFET technology, actually in the short term is no longer meaningful.