Japanese media said the Japanese semiconductor device association has announced in August order amount of semiconductor manufacturing equipment (3 months moving average, the speed value) for 134.8 billion yen (RMB 9 billion), up 30.8% from a year earlier. This is first time since March 2014 (34.0%) of 29 months the growth rate of more than 30% for the first time. China's semiconductor manufacturers, semiconductor ultra-micronization model.the, three-dimensional these three big change for the whole industry has brought vitality. Evolution between semiconductor equipment manufacturers, on the other hand, may also become more obvious.
According to foreign media reports, "ahead of time of purchasing equipment", tepco electronic President river close to the tree, could not hide his semiconductor manufacturers strong investment in equipment to surprise.
In August, semiconductor equipment book-to-bill ratio (B/B value of the order amount divided by the amount of delivery) is 1.18, nine consecutive months above from line 1. Product just sold and you have more new orders come in, the state continued.
According to the report, China is one of the reasons why the state, such as Chinese violet light group factory to a new large storage. Five years is expected between now and 2020, the total investment will reach 5 trillion yen (RMB 332 billion), is 2 times more than in the past five years. The Chinese government will semiconductor industry as a pillar industry, at the same time actively promote investment in foreign companies.
The second reason is ultra-micronization model.the semiconductor circuit. In the field of cutting-edge, electric line width is welcomed by more than 10 nm to 7 to 10 nm transition. Can one-time write small circuit wafers holistic development remains to be seen (extreme ultraviolet carved) technology, the current through repeatedly made small circuit, film forming equipment and equipment corrosion is increasing.
The third reason is the three-dimensional semiconductor circuit. Server using the storage device such as a, now have begun to use 3 d stacked vertically NAND storage devices. Compared with the traditional flat storage devices, this kind of stereo equipment can increase the storage capacity of unit size chip. South Korea's samsung electronics, the Microsoft, Toshiba are on the increase production equipment.
This 3 big changes are likely to widens the gap between equipment manufacturing enterprises. Semiconductor and ultra-micronization model.the three-dimensional technology requirements for equipment improved. The analysis thinks, technology will be determinants of semiconductor equipment manufacturers. China's semiconductor manufacturers trend has many opaque. Some foreign manufacturers of Japanese corporate President thinks "information collecting ability decides the quantity of goods in China".
