In the outline of national integrated circuit industry development after the release, sped up the industrial layout in our country. In addition to the wafer manufacturing, as the integrated circuit industry chain after a period of key links of encapsulation testing also obtained fast development. In 2015 at the national integrated circuit industry investment fund (hereinafter referred to as "funds"), under the support of long telegram technology acquired the former global ranking fourth testing factory star chippac, tong fu has acquired AMD two micro electric testing factory. Recently the news that the whole rich micro electric will buy the second largest assembly house ecker (Amkor). Mainland China, the rumours do or not testing industry is growing rapidly, has become a global industry is one of the big three sealing test.
Merger and reorganization, into three global sealing test
As the semiconductor technology according to the feature sizes, etc. The further development of scaling, silicon CMOS technology in multiple aspects, such as speed, power consumption, integration, cost are subject to a series of basic physical properties, such as investment restrictions. Encapsulated into one of the important ways to solve these technical bottleneck. Therefore, merger and reorganization, improve industrial concentration, become bigger and stronger China's packaging industry, and promote the development of the integrated circuit industry a key cog.
It is under the guidance of this idea, since last year, with the support of large funds, long telegram technology for $780 million acquisition of star chippac company. According to the data of dramexchange, long telegram technology + star chippac, in the global market share of 9.8%. Tong fu micro electric paid about $370 million acquisition of AMD's factory and Malaysia penang factory in suzhou. Dramexchange statistics show, in 2015 through the rich micro electric city at a rate of 1.4%.
Recently the news that the whole rich micro electric will acquire the encapsulation of the second largest company ecker (Amkor). If the accurate, rich micro electric will surpass jiangsu long telegram, become China testing industry, the leading global ranking will also shot up to the second, their leading factory, the moonlight; Even if the news is not true, merger and reorganization, improve industrial concentration, the general trend of development of testing industry will not change.
, vice President of China semiconductor industry association integrated circuit branch secretary, national integrated circuit testing industry chain technology innovation strategy alliance secretary-general Yu Xiekang said: "to further promote the development of testing industry, mergers and reorganization is one of the important means. Through increasing industry consolidation, to cultivate one or two large internationally competitive companies, is one way to revive the integrated circuit testing industry as soon as possible. For integrated circuit testing industry, by advancing enterprise merger and reorganization, will be able to perfect industrial chain extension, improve industrial concentration, promote the scale, intensive management, the formation of one or two play a leading role in the industry of large enterprises and groups, is conducive to adjusting and optimizing industrial structure, promote the sustained and healthy development of industry."
According to the economic research institute in Taiwan, opened last year after a series of testing industry international merger and acquisition (m&a), the global top 10 testing factory three camps are present, the Chinese mainland enterprises into among them, including engineering, with silicon product (in May this year, ranking the first day of the moonlight with silicon product form, which is the third largest industry holding company), ecker and J - Devices (Amkor announced earlier this year to complete the original factory of the world's sixth seal test J - Devices), long telegram technology with the stars chippac. From the camp of global market share semiconductor packaging and testing, engineering, with silicon products accounted for the highest rate of city, the proportion of about 28.9%, followed by ecker, market share is about 11.3%, long telegram chippac (star) of science and technology city accounted for 9.8%. Mainland China testing industry has become one of the big three global testing map.
SiP development, promote the industry to the high-end
At present, the global IC industry is entering a major adjustment period, the whole industry chain technology by leaps and bounds, to high-end field is imperative. Yu Xiekang introduction: according to the "3 c electronic market as the main supporting power of encapsulation testing market in China, will push over the next ten years, ultra miniaturization, high density, high performance chip pins of all kinds of BGA, CSP, WLP, MCM and SiP the rapid development of advanced packaging products and testing technology, automotive electronics, power electronics, smart grid, such as industrial process control and new energy electronic market and national large aircraft, aerospace project, also need to be more reliable, higher performance, more diversified BGA, PGA, CSP, QFN sealing products measuring and testing technology, the emerging Internet of things and medical electronics also need to be more integrated, more flexibility, more testing technology and new packaging format RF radio frequency MEMS and biological electronic product packaging, packaging, package (SiP) products form."
Overall, in the field of chip packaging, electronic system or the whole machine is toward multi-function, high performance, miniaturization, light-duty, portable, high speed, low power consumption and high reliability direction. That is to say, the merger and reorganization is just means, purpose is to promote China's packaging industry and the technology to the field of high-end.
Prior to this, tong fu shi lei, general manager of micro electricity in an interview with reporters said that until today in development of semiconductor technology, 28 nm SOC products is a node, cost drive factors had largely disappeared, with the rapid development of semiconductor is losing cost this engine. And SiP can make up for the lack of power, the China's semiconductor industry, on the whole sealing test is a very important time window. Electronic products, how to do more thin, SiP is a trend. The electronics assembly technology has been unable to realize, micro assembly will become mainstream, through rich micro electric development of advanced packaging WLP, FC, BGA technology, the next step for the company to lay a good foundation for the comprehensive production SiP.
Star chippac, AMD testing plant and so on enterprise's product structure such as smart phones, PC and server CPU encapsulation is given priority to, the Chinese mainland enterprises through mergers, digestion, absorption and innovation, improving the capacity of service in the field of high-end testing and competitiveness.
