Last week, MacRumors bask in the face of positive and negative of 7 out of the iPhone motherboard, and has carried on the detailed comparison with former generation products. In comparison of the current generation of product bare board room after that apple has given up modem module of qualcomm, and adopt the baseband of Intel. Of course, this also can't rule out apple would launch iPhone Plus 7/7 based on qualcomm baseband circuit board may support of different LTE band (such as rumours international edition baseband).

IPhone 7 Intel motherboard seemed to set aside the baseband weld leg size (on suspected Intel XMM 7360) as stated in the official website, because it and qualcomm MDM9635 difference is very big (see iFixit dismantling the iPhone 6 s bare plate).

According to the dimensions of the transceiver in Intel reference design with the modem SMARTi 5 RF transceiver, does not appear in the so-called iPhone motherboard, but don't rule out the possibility of apple custom or not announced. (qualcomm seems to still provide RF transceiver for apple)

Although not completely corresponding to the pins on the back of the package size and layout is in conformity with the WTR3925, in addition to the iPhone on 6 s/s Plus qualcomm power management chip.

Near the bottom of the transceiver rear, we see a lot of changes. Such as metal barrier between RF and audio/battery components from horizontal to the vertical direction, audio power amplifier and the battery area increased. Rumored removed the headphone jack iPhone 7, apple is likely to cut down a set of power amplifier, but it was not immediately clear exactly what happens. Previously leaked the inversion of screen line, also suggested that the introduction of the capacitive Home button.

Finally, SoC is a behavior on the edge of the four empty A10 (A9), we usually in larger chip (such as desktop CPU) see, the main is the core in order to separate the power supply and signal. To do so, of course, also brought some compromise, such as though the A9 than A8 core size small, but the packaging size and ate kui. Should be able to use the same as the A9 A10 16 nm FinFET craft, but optimized properly, the increase of the transistor will not bring the large size of packaging change.