Recently held in Santa Clara, California, Flash Summit (Flash Memory Summit), micron released their first 3 d NAND Flash Memory chips. The flash memory chip without changing the size of the cases, can provide more storage space. According to PCWorld, micron this 3 d flash chips has a capacity of 32 gb, its target market for high end smartphones. The product is based on the new it 2.1 standard, the smart phones are not to use this theory on market faster storage agreement.

Micron think smartphone is higher and higher demand for memory capacity, application of virtual reality and stream media will take up a lot of storage space. Within a few years, they say, smart phone memory may reach now PC level, in particular, probably will reach 1 TB in 2020. But the company did not disclose the 3 d flash memory chips used in mobile devices of their own development road map.

With the conventional 2 d NAND level configuration storage unit is different, the 3 d NAND configuration storage unit using vertical way, this way can not only have higher capacity, can make communication between chip fast again.

3 d is not exclusive to micron NAND flash memory chip technology, Intel and samsung have the application of this technology on SSD, the capacity of the related products only will be more and more big.