ASML declared its four EUV orders Q2, expected next year EUV shipment of more than 10 sets.
Repeated delays EUV lithography equipment, and the latest news may in 2020 can enter the volume production, and very likely applications in 5 nm node.
To the production of 1 ZNM storage industry forecast the future there may be two or more layers will adopt it, and in the most advanced process node (7 or 5 nm) logic devices in production may be 6 to 9 layer will use it.
ASML plan in 2018 its holistic equipment capacity doubled up to 24 sets of produce, sells for about $100 million each, the chip maker has been installed 8 units, making all kinds of tests.
Semiconductor advisors analyst Robert Maire believes that is can be applied to production should be around 2020, when the 5 nm. TSMC recently announced its plan in 5 nm node.
Maire said Intel may have a different point of view, it USES the EUV equipment in 7 nm, because it has the potential to enter the second half of the year 10 nm.
Because now 16/14 nm node usually adopts the technology of the double patterning, if EUV successful production, can be avoided in 10 nm and should be used when the following three or four patterning technology, cost savings substantially.
From 20 nm node began to adopt double patterning technology, chip maker for the process node into two categories, such as 20 nm and 10 nm are transitional nodes, relative technology of life is short, and 28 nm, 16/14 nm and 7 nm node could be a long life.
ASML marketing director Michael said Lercel EUV system production need to install a 250 - watt light source, ensure that 125 pieces per hour, and now the light is 125 watts, only 85 pieces per hour, ASML are working on a 210 - watt light source in the laboratory.
Now more than 200 watts of EUV light source has two suppliers, respectively is the Cymer and Gigaphoton ASML. Both suppliers think 500 - watt light source has a possibility in the future.
Currently used for EUV mask protect Pellicle can only bear the heat load of 125 watts, leaving 250 watts of vision has a distance.
Because the EUV lithography glue it work mode is to use the reflection of the two electrons, different usually 193 nm photoresist, therefore needs to break through.
The holistic cost very close to three patterning technology.
ASML hope it can have a greater than 90% of the holistic system uptime, but at present it in 4 weeks working cycle uptine greater than 80%.
From r&d to mass production equipment has the very big difference. Light source system reliability requirements is very high, even if the system work in a vacuum environment requirements can hit 50000 times per second melted tin beads. So new light source volume is large, compared to before excimer laser source is more complex, it is as large as the size of the refrigerator, work in clean workshop.
So far, global EUV lithography orders, Intel has five units, with four orders, TSMC has five units, with two orders, samsung has three, with three orders, GF is 1, with 1 order, IMEC have 2 sets, Toshiba and hynix each have 1 and micron have 1 order.
