Today, ITRS issued a report forecasting, said chip, Moore's law, or failure in 2021. As we know, silicon chip manufacturing technology is approaching the physical limits. Prose poems in China, according to the analysis to meet the requirements of Moore's law growth, or looking for new materials to replace silicon, graphene, molybdenum disulfide, or single atomic layer ge, or innovative ways to develop the ability of the silicon chip, will more conform to the requirements of the new materials and efficient integrated on a silicon substrate.
, by contrast, completely replace the original technical route, not only need a lot of money, full of competition and collaboration are essential; Deep exploration in mature technology, low cost, although many, but difficult to dramatic new formats.
It is reported that the United States north Carolina state university recently announced, said the researchers in collaboration with the U.S. army research office has developed a new method called "thin", multiferroic materials such as new functional materials can be integrated to a computer chip. According to understand, to integrate the new functional materials with the silicon chip, help to create future lighter, intelligent electronic devices and systems, can make a lot of people used to think that the impossible possible, for example, detection, data acquisition, processing and other tasks may be performed on a compact chip, in addition to the light emitting diode (LED) used in the sapphire substrate cannot be compatible with computer equipment the problem will be solved.
For now, some new functional materials, such as ferroelectric and ferromagnetic properties of multiferroic materials, surface conductivity of topological insulators and new type of ferroelectric materials, etc., in the sensors, nonvolatile memory and microcomputer electric field has a good application prospect. But the material is facing a problem, since they can be integrated on the silicon chip. At present, the new study helps break through the limit.
, researchers say, is the so-called "thin", is that they designed a titanium nitride layer plate and yttrium stabilized zirconia plate layer of the two can be compatible with silicon plate layer, new functional materials with different electronic products used to connect the bottom layer of silicon substrate (platform), and then take advantage of the development of a set of buffer film, to integrate the functional materials with the silicon chip. The film through a combined with the crystalline structure of the new type of functional material, the other side with the underlying substrate to play a role of connection. , researchers say, along with the change in the integration of functional materials, the use of film composition changes. Integrated multiferroic materials, for example, when the use of titanium nitride, magnesium, strontium and lanthanum oxide strontium these four types of manganese oxide film combination, but if you want to integrate the topological insulators, so only need magnesium oxide and titanium nitride is ok. It is understood that the related research results published in the journal physical review application.
