1. The mainland IC accelerating securitization, ten companies plan to IPO; 2. SEMI: Taiwan, China will continue to drive the wafer foundry capacity investment; 3.2016 years of semiconductor equipment spending will be slightly increase next year is expected to rebound; 4. The integrated circuit industry rapid development The localization of the release of new advanced; 5. China electronic information enterprises announced: huawei first purple light 18; 6. To the mainland listed? TSMC: didn't plan did not consider

1. The mainland IC accelerating securitization, ten companies plan to IPO;

Media reported that lu with the industry transfer, is under the double trends of national energetical support, integrated circuit industry also boarded the mainland capital express, accelerate the securitization, there are more and more integrated circuit enterprises start IPO plans, so far been trillion easy to innovation, the micro, core micro IPO news released about ten companies, such as which, in addition to the IC design companies, also including jiangfeng electronics, qing overflow photoelectric niche in the industry of the enterprise, according to mainland companies in the semiconductor industry core area is taking shape.

Have learned, since to (2015) years, the mainland has been the science and technology, science and technology, embellish hin JingJiaWei success of landing a-share market, due to the integrated circuits in stage of industrial development, the company by the market and investors, or even ten times the gains. Rui core micro in an IPO earlier this month to disclose, and signs in the innovation, the micro, red core micro has released the IPO information about ten companies such as, the number is considerable.

In the project of the IPO, in addition to the chip design companies, niche rookie also emerge, jiangfeng electronics, for example, funds raised by a company for yearly produces 400 tons of flat-panel display panels molybdenum sputtering target materials billet industrialization project, annual output of 300 tons of electronic grade ultra high purity copper production project, annual output of 300 tons of electronic grade ultra high purity aluminum production projects, etc., its main customers include smic in the field of semiconductor, TSMC, Toshiba, hynix, stmicroelectronics, well-known manufacturers such as flat-panel displays the customer has boe, TCL, huaxing photoelectric, etc.

Two rounds of the personage inside course of study says, as the mainland industry support, the continued implementation of "one thousand project", Chinese IC industry has accumulated in the field of these more core, segmentation results; Data show that the micro plasma dielectric semiconductor Quality, and the etching machine has broken into the national monopoly, international companies supply chain; Shanghai microelectronics equipment advanced lithography and mega sonic single crystal of semiconductor cleaning machines have more than one delivery, and overseas sales.

According to preliminary statistics, since late last year, there have been 12 cross-border acquisition integration assets of listed companies, including thousands of industry enterprises make shell pudong branch, dagang shares apotheker semiconductor IC packaging enterprise m&a cases; In addition, SAN MAO sent god chose chip design company the core science and technology as a restructuring targets, despite all the core technology is in loss, but its evaluation increment rate more than 31 times.

In addition to using public platform of capital operation, various industrial capital, it sets up the integrated circuit industry mergers and acquisitions in intensive fund. According to statistics, including boe, TCL, lianchuang electronics, huaxi co, hagrid communication such as a set of nearly 20 billion yuan of listed company of industry mergers and acquisitions funds, to the growth in cross-border investment. The personage inside course of study says, the national policy on the mainland and "big fund" continuous support and guidance, industrial capital has begun to be driven, and this effect continues to enlarge, as the second phase of the establishment of the "big fund," is expected to attract more capital into the IC industry, and continue to boost the development of the industry. Lean news

2. SEMI: Taiwan, China will continue to drive the wafer foundry capacity investment;

According to the SEMI international semiconductor industry association () the whole chip factory prediction (World overall Forecast) according to the report, overall industrial production has surpassed 2015 wafer generation memory, become the largest sector of the semiconductor industry, and in the next few years is expected to continue to lead. Expect wafer foundry production capacity will grow by 5% a year, go beyond the industry overall performance, wafer foundry production capacity by the end of 2017 is expected to reach 6 million pieces a month about when the wafer (8 inches).

Overall industrial production has surpassed 2015 wafer generation memory, become the largest sector of the semiconductor industry, and in the next few years is expected to continue to lead.

Taiwan crown of wafer foundry production capacity in the world, including 12 inch capacity of whole chip foundry capacity proportion more than 55%. TSMC and umc is Taiwan wafer foundry production capacity of the two main driving force. TSMC twelve factory stage 7, 15 fifth and sixth is actively preparing for the following 10 nanometers process capacity. Umc continued to expand capacity, 28 nanometers. Ready to put A factory of the fifth period is 14 nai metric.

The other side, a wafer foundry production capacity of the world's second is the fastest growing market in China. In 2015 China's overall wafer foundry production capacity of 950000 pieces per month, is expected to the end of 2017 will increase to 1.2 million pieces per month, almost 20% of global wafer foundry production capacity. China wafer foundry leading semiconductor manufacturing international (SMIC) is committed to promoting Beijing B1 factory and Shanghai eight factory (both for the 12 inch factory), and other existing factory capacity. At the same time the company also is rising new 15 B2 factory (12 inches) in Beijing and shenzhen factory (8 inches) capacity. Smic expansion project at the same time contains 28 advanced nano / 40 nanometers capacity, as well as the mature technology of 8 inch wafer process. Other companies expand capacity include wuhan new core (XMC), its capacity will continue to put A factory NOR flash memory foundry business; Shanghai vander-waalsforces (Huali) will set up a second fabs, is expected next year, construction since the second half of 2018 is expected to start betting capacity.

In the next few years, Taiwan wafer generation industry will also be a contribution to Chinese wafer foundry production capacity. Later this year umc 12 x factory is located in xiamen will start production, powerful crystal hefei factory in 2017, TSMC nanjing factory will be launched in 2018. The facility after full production, will lead to at least 110000 pieces per month (12 inches) wafer production capacity.

In addition to increasing production capacity, advanced process technology competition is particularly fierce. TSMC, Samsung (Samsung) and Romania DE (fab), all want to lead under 10 nanometers technology node. The evolution of technology will drive the wafer generation industry continued investment in the next few years, with the greatest again in Taiwan and China.

SEMI Cao Shiguan Taiwan President, said the "global semiconductor industry stable growth in 2016, Taiwan semiconductor industry growth rate is better than the world, especially foundries in process innovation, increased investment in new production capacity and equipment will be ahead of other makers, also on behalf of Taiwan continues to play in the global semiconductor industry technology and production capacity of leading role." CTIMES

3.2016 years of semiconductor equipment spending will be slightly increase next year is expected to rebound;

The international semiconductor industry association (SEMI), according to the latest report 2016 global semiconductor equipment spending forecast of $36.94 billion, compared with 2015 edged up only 1.1%, but the forecast is expected to surge to $2017 in 41.08 billion, up 11.2% over 2016.

Type of equipment, Wafer Processing (Wafer Processing) is the next two years the strongest growth momentum of semiconductor devices, is expected to grow 1.9% and 12.8%, respectively; Encapsulation equipment and test equipment is mediocre, the former in the next two years the growth rate of 5.0% and 5.0% respectively, the latter is 0.9% and 3.0%.

According to according to the difference, the fastest growing areas of semiconductor equipment spending in 2016 was China, grew up to 30.8%, but is expected next year China's semiconductor equipment spending growth rate will slow sharply, only 12.9%. South Korea's semiconductor equipment spending is expected to be a sharp rebound in 2017, up 29.5% over 2016. But overall, Taiwan this year and will remain the world's largest semiconductor equipment area, semiconductor equipment needs to $10.02 billion in 2017. The new electronic