According to the SEMI international semiconductor industry association () the whole chip factory prediction (World overall Forecast) according to the report, overall industrial production has surpassed 2015 wafer generation memory, become the largest sector of the semiconductor industry, and in the next few years is expected to continue to lead. Expect wafer foundry production capacity will grow by 5% a year, go beyond the industry overall performance, wafer foundry production capacity by the end of 2017 is expected to reach 6 million pieces a month about when the wafer (8 inches).
Overall industrial production has surpassed 2015 wafer generation memory, become the largest sector of the semiconductor industry, and in the next few years is expected to continue to lead.
Taiwan crown of wafer foundry production capacity in the world, including 12 inch capacity of whole chip foundry capacity proportion more than 55%. TSMC and umc is Taiwan wafer foundry production capacity of the two main driving force. TSMC twelve factory stage 7, 15 fifth and sixth is actively preparing for the following 10 nanometers process capacity. Umc continued to expand capacity, 28 nanometers. Ready to put A factory of the fifth period is 14 nai metric.
Wafer foundry capacity, on the other hand, the second China is the fastest growing market in the world. In 2015 China's overall wafer foundry production capacity of 950000 pieces per month, is expected to the end of 2017 will increase to 1.2 million pieces per month, accounts for chip foundry production capacity of nearly 20%. China wafer foundry leading semiconductor manufacturing international (SMIC) is committed to promoting Beijing B1 factory and Shanghai eight factory (both for the 12 inch factory), and other existing factory capacity. At the same time the company also is rising new 15 B2 factory (12 inches) in Beijing and shenzhen factory (8 inches) capacity. Smic expansion project at the same time contains 28 advanced nano / 40 nanometers capacity, as well as the mature technology of 8 inch wafer process. Other companies expand capacity include wuhan new core (XMC), its capacity will continue to put A factory NOR flash memory foundry business; Shanghai vander-waalsforces (Huali) will set up a second fabs, is expected to start next year, since the second half of 2018 is expected to start betting capacity.
In the next few years, Taiwan wafer generation industry will also be a contribution to Chinese wafer foundry production capacity. Later this year umc 12 x factory is located in xiamen will start production, powerful crystal hefei factory in 2017, TSMC nanjing factory will be launched in 2018. The facility after full production, will lead to at least 110000 pieces per month (12 inches) wafer production capacity.
In addition to increasing production capacity, advanced process technology competition is particularly fierce. TSMC, Samsung (Samsung) and Romania DE (fab), all want to lead under 10 nanometers technology node. The evolution of technology will drive the wafer generation industry continued investment in the next few years, with the greatest again in Taiwan and China.
SEMI Cao Shiguan Taiwan President, said the "global semiconductor industry stable growth in 2016, Taiwan semiconductor industry growth rate is better than the world, especially foundries in process innovation, increased investment in new production capacity and equipment will be ahead of other makers, also on behalf of Taiwan continues to play in the global semiconductor industry technology and production capacity of leading role."
