Benefit from the mainland economy continues to grow, and given priority to with low order smartphone shipments of the mobile device also grew in during this period, Chinese IC industry output value growth year by year from 2010 $2010 to $57.97 billion, 2015, 2010 ~ 2015 annual compound growth rate of 19.1%. DIGITIME Research estimates, while smartphone shipments slowing growth, coupled with the global economic outlook, uncertainty still high, but IC domestic demand market can still stable growth in mainland China, coupled with the semiconductor industry policy support, driven by Chinese IC industry output value will reach $2016 in 66.64 billion, the year growth of 15%.

The 12th five-year plan period, thanks to global smartphone, especially grew in low order smartphone shipments, IC design industry has become a leading Chinese IC industry output growth momentum, the most important value by $2010 in 5.66 billion to grow year after year to $21.28 billion, 2015, 2010 ~ 2015 annual compound growth rate of 30.3%, growth performance is far better than IC manufacturing and assembly industry.

Mainland from 2011 to 2015 in the top 10 IC design company total revenue annual compound growth rate of 30.1%, but the IC design industry output value proportion of running in four levels, only did not meet industrial concentration ascending trend, in addition to the mainland shows that small and medium-sized mainland IC design companies also have contributed to the IC design industry important growth momentum, IC design company is a rapidly increasing number of mainland, also to drive the output growth of the important reasons for the China IC design industry, DIGITIMES Research estimates, much starker choices-and graver consequences-in planning period, China IC design companies will have the opportunity to more than 1000.

In IC design industry can still maintain a strong growth momentum, IC manufacturing under the expectations of new capacity will continue to pay, DIGITIMES Research estimates that 2016 IC, IC manufacturing mainland IC industry output value proportion to 37.9%, 26% respectively, encapsulation testing continued to be squeezed, accounts for only 36.1% of the Chinese IC industry output value proportion, Chinese IC industry structure will be 40% in IC design, IC manufacturing and packaging test each 30% of policy goals.