Samsung for a new generation of apple A10 processor orders failed, not the processor process technology behind TSMC, but failed in chip packaging technology.

South Korea economic daily reported citing people familiar with the news, is mainly specialized in manufacturing PCB samsung motors (Semco), has been ordered to support samsung electronics, the two formed a special task force to expand FoWLP packaging research and development work has been half a year.

FoWLP encapsulation, remove PCB electric line links between straight onto the wafer, not only can save the unit cost of production, also can reduce the thickness of the wafer, market competitiveness. In addition to logic chips, FoWLP encapsulation could be applied to memory and power management chip.

According to south Korean online media reported last week that "News1" unnamed industry news shows, TSMC A10 winner-take-all processor orders, not only to the next generation of A11 processor orders also early fall bags, has nothing to do but why packaging technology, but samsung foundry A9 processor power consumption is higher than version, TSMC for apple in disappointment.