This year China semiconductor industry still maintain rapid growth pattern, mainly thanks to the mainland market for import substitution, bring development space for local enterprises.
And 12-inch wafer fabs, 8 inches production line and process technology, module and the development of the IP core for smart grid, intelligent transportation, intelligent household and other things related integrated circuit products, provide strong support, as well as foreign companies to increase the size of the investment on the mainland, but more importantly in mainland China the government's policy of supporting, such as "made in China 2025", much starker choices-and graver consequences-in planning and development strategy in the new century.
For integrate circuit manufacturing, global 12-inch fabs capacity to China is a foregone conclusion, China's existing 12-inch fabs capacity total of 420000 pieces per month, including semiconductor manufacturing international (Beijing), smic (Shanghai), SK Hynix, Intel (dalian), wuhan new core LiWei electronics, Samsung, China, 2016-2016 China's new 12-inch fabs output can be as high as 635000 / month, global 12-inch wafer plant capacity proportion will rise from 10% in 2016 to 22% in 2018.
Future China about 12 inch plant capacity will be enough to global semiconductor market, on the other hand also represent the rise of China's semiconductor power cooperation, to the Chinese national flag in the strategy, expected that those business opportunities in the future.
It is worth mentioning that in the 2016-2018 China's new 12-inch fabs capacity will include from Taiwan's TSMC, umc, crystal, various in xiamen, nanjing, hefei and other places set up 12 inch factory, and come From producers in the United States has Intel, Global Foundries, each in dalian, chongqing investment of $5.5 billion, $2 billion, as for the local Chinese manufacturers have China LiWei electronic, wuhan new core, tongfang core.
In terms of IC design industry, due to the high order general chip, mobile intelligent terminal chip, digital television, network communication chip, wisdom, dressing equipment, military chip, integrated circuit chip design software, and other fields, China's integrated circuit industry will still be 2016 big fund investment target for this industry, this showed countries support the development of IC design industry attitude is quite clear, so the design of mainland companies technology and customer level will continue to get a promotion.
From the point of semiconductor packaging and testing industry, the policy to prop up, m&a synergy emerge, local IC design industry under the blessing of the rise, in 2016 China's semiconductor packaging and test industry output growth will be higher than in 2015.
Values have to mention is that, the moonlight announced with the silicon product industry group holding company, in addition to reduce competition, collectivization model to deal with other regional competitors, also of the industry to create semiconductor sealing test, TSMC, more than 30% market share, will grasp the full range of advanced packaging technology, dominates the world's largest semiconductor testing leading status, also means that the packaging and test industry is toward the evolution of the trend of collectivization.
Under the Taiwan enterprise combining the sealing test, the future will make China's semiconductor testing is expected to further enhance the consolidation or merger and acquisition, worth Taiwan players on high alert.
