TSMC grabbed the Apple (Apple) processor A10 OEM orders, Samsung Electronics, Samsung Electronics system LSI division says the key is that TSMC have Fan out type wafer level packaging (Fan - out WLP; FoWLP) after the period of manufacturing competitiveness, TSMC called Integrated Fan type packaging (Integrated Fan out; the InFO), Samsung decided to integrate group strength, for this by Samsung motors (Semco) extends semiconductor packaging market, with Samsung Electronics FoWLP develop technology, and in a new round of customer orders for the game, against TSMC in an all-round way.
Korea media ET News reports, the rumors Samsung motors from Samsung Display (Display) receive the cheonan factory old liquid crystal Display (LCD) production line after the L3 and L4, set out to transform plant into semiconductor packaging factory, recent equipment orders sent to the related encapsulation equipment industry, the first batch of equipment will be in warehouse in August, is expected to evaluate the possibility of mass production by the end of 2016, the fastest can be launched in early 2017.
This is the first time samsung motor across the semiconductor packaging business, production line conversion plan into mass of samsung motor system LSI team manpower and samsung, samsung electronics, through the cooperation with samsung motor strategy, will help to develop to meet the requirements of customer packaging technology; Samsung motor is available through a career in packaging, reduce the shipment for printed circuit boards to reduce performance impact.
Samsung electronics system LSI career will be used for mobile application processor (AP) power management IC, by samsung motor FoWLP encapsulation, the future will gradually FoWLP encapsulation will extend to the radio frequency (RF) with other AP chips, samsung interested after the first packaging production line to start the motor, add the second and third three production lines.
FoWLP encapsulation system adopts pull out method, can make various different naked (Die) made like crystal wafer level packaging (WLP) process as buried inside, reduce a layer of packaging, because FoWLP encapsulation without using printed circuit board, the production cost is low, and the thickness is thinner, heat dissipation function better. Regarded as samsung motors decided to across the full assembly field, should be related to packaging with printed circuit board market demand to reduce.
Apple decided to adopt the InFO TSMC technology production for the new iPhone A10 processor, grasp this technology because of TSMC, the upper hand in the battle for apple OEM orders. Apple in addition to the AP, also decided to multi-frequency antenna switch module chip encapsulation adopt FoWLP technology, open the door for FoWLP packaging market.
Compared with TSMC in circular wafer line heavy cloth Layer on the substrate (" Redistribution Layer; RDL) process, using a rectangular substrate with samsung, samsung motor with a Panel Level Package (PLP) manner FoWLP encapsulation. Samsung motors will hopefully samsung display old LCD factory exposure equipment, used for FoWLP encapsulation process again, because of the large area can be made, samsung target than TSMC will encapsulate costs down to a lower level.
The industry said that samsung motor can be through the development of packaging enterprise, offset packaging with printed circuit board revenue to reduce influence, from the Angle of the samsung group, cooperation between by subsidiary, make concerted efforts against TSMC, and grab a new generation of apple products OEM orders.
