From 2016 to 2017, China will do more than half the world's foundries construction projects, the upstream of semiconductor equipment manufacturers will get a lot of orders...

According to the statistics, SEMI global in 2016 and 2017 will begin to build fabs at least 19, more than half of them are in China; In 2016, the global semiconductor manufacturers chip manufacturing equipment spending estimates will hit $36 billion, a 1.5% increase over 2015, 2017, is expected to grow 13%, to $40.7 billion.

Exclusive (including new, used and the in - house) fabs equipment spending, a 2% decline in 2015; And SEMI expectations, 3 d NAND flash memory, 10 nm logic process and the trade union of wafer generation is 2016 and 2017 the main fabs equipment spending. SEMI lists 19 sixty percent possibility will be carried out in accordance with the schedule of the fab construction case, some of them have started building, others may be delayed or pushed to the next few years.

But in SEMI responsible for tracking of the construction of the fabs analyst Christian Dieseldorff accept EE Times interview, with a record history, in 2016 and 2017 have 19 fabs started building, quantity is low: "we will see less and less new fabs, this is because there are more vendors is to be able to upgrade or retrofitting existing plants."

In wafer size, the 19 fabs (production line) 12 of 12 inches (300 mm), four is eight inches (200 mm), and 3 are LED factory, respectively is 6 inches (150 mm), 4 inches (100 mm) and 2 inches (50 mm). Not including LED factory, the new fabs (line) of installed capacity, estimated in 2016 started building the initial wafers can reach 120000 slices per month (about 12 inches when), in 2017 started building the initial wafers can reach 330000 a month about when (12 inches).