All the knowledge, the current LED chip can be divided into three kinds of structure, the first is a formal chip, the second is vertical chip, and the third is the flip chip - FC - LED, and at present in the majority with formal chip.
Suits the majority share, does not influence the development of inversion. Although the flip chip city didn't occupy large market share, but its structure is indeed a lot, have a ceramic substrate, with single encapsulated, the integrated encapsulation and CSP. The scaffolding inversion is one of the structure of the flip chip packages.
The emergence of scaffolding inversion, actually is associated with formal chip. Because before dress is scaffolding, and related equipment is also with the match. Based on such background, just can have today the concept of scaffolding inversion. Which refers to the flip chip + cup cavity stents, and FEMC refers to "the Filp chip + EMC support", is the flip chip and EMC stent with the combination of packaging products, scaffolding is encapsulated one of them.
And Switzerland abundant current scaffolding inversion mainly EMC support as the carrier, no matter from the thermal resistance and junction temperature, voltage, saturation current and thermal steady state lumens, compared to common SMD, ceramic FC, COBFC, CSP has a big advantage.
Scaffolding inversion
From the point of LED packaging market capacity, ceramic and COB packaging accounts for about 3% of LED encapsulation device, EMC (20%), PLCC accounted for about 75%, visible at present for most of the scaffolding of the LED packaging, and import the flip chip in the scaffolding encapsulation, it will be a revolution to the traditional packaging. According to LEDinside, according to data from 2002 to 2017, flip chip compound annual growth rate of 99%, while nearly three times the growth of the flip chip stents.
From a technical perspective, scaffolding and CSP, ceramic packing, COB packaging is the biggest difference is that scaffolding is not a simple two-dimensional plane packaging.
From the point of reliability and equipment matching, because of the advantages of flip chip, the scaffolding flip the saturation current of bigger, better withstand current, product reliability will be better. Can meet again at the same time more universal patch technology level, although the CSP packaging has many advantages, but when the patch, requiring to equipment. Thus scaffolding encapsulation, besides have protective easier when you in the application.
From the solid material, compared to suit EMC encapsulation, flip bracket of packages of the solder paste thermal conductivity is higher than that of insulated, for the reliability of the whole product is a very good protection.
From the Angle of photosynthetic efficiency, although, at present, flip chip out of light efficiency cannot be compared with assembling a chip, but for the requirements is not very high light efficiency, it has very good single lamp light transmittance, because of its low voltage. So overall, if you don't think too much light, use flip chip products can reduce the cost of integrated light sources. Especially on the TV backlight application, because the glass light transmittance is more and more low, than not so high to the requirement of LED lights, so basically can achieve seamless cuts.
Scaffolding inversion FEMC encapsulation process
Scaffolding flip LED encapsulation process, is simply through the use of 3 d printing technology, the solder paste printing on the scaffold, and then through the reflow soldering and potting implementation encapsulation process.
But in practice, will encounter a few big problem. First is the problem of secondary reflow soldering; The second is the empty rate. Finally the leakage death lamp. In the past more than a year of time, ruifeng overcome all these difficulties.
For traditional packaging, if scaffolding inversion can go, for the LED industry, packaging industry, in particular, will be a big change.
