It is reported that samsung is developing new wafer level packaging technology sector, is to attempt to TSMC (TSMC), in the fierce competition, more than the iPhone smartphone processor orders. In the future, after successfully in the technology research and development, in the high-end chip encapsulation will no longer need to use printed circuit board, can make the smartphone design achieve future thinner, higher efficiency of the development.
Report points out, called the fan to the FoWLP wafer level packaging technology, the future will be samsung from TSMC snatched apple order an important tool. Reported, quoting an anonymous analyst pointed out that although has almost guaranteed, TSMC has become the apple in 2016 will launch a new iPhone (iPhone 7) processor manufacturers. However, through FoWLP fan wafer level packaging technology, samsung expected in the next generation of new iPhone (iPhone 7 s) from TSMC take back some orders.
However, the analyst stressed that if samsung from TSMC rob back part of the order of the iPhone, its key lies in samsung how many percentage of capacity will use FoWLP fan wafer level packaging technology. At present, because relative to samsung, TSMC future will continue to maintain 50% to 60% of capacity using the wafer level packaging technology. It is understood that in the future if the samsung FoWLP wafer level packaging technology sector, for the new mobile phone will be lower than 0.3 mm thickness, and improve overall efficiency of more than 30% of the mobile phone.
Report also stressed that according to hana financial investment, according to a report after TSMC, samsung, new development of wafer level packaging technology sector, helps to reduce the company's investment in advanced circuit connection (ACI) and indirectly reduce the samsung group for medium and long term potential risks. However, the report still question samsung's fan wafer level packaging technology to mass production until the first half of 2017, the Taiwan semiconductor wafer level packaging technology, the third season will start from 2016 began production embedded chip, this point in time for samsung is still at a disadvantage.
