Recently visited the exhibition, I feel quite excited, saw the fruits are grown, the application of a lot of flip chip onto the stage. "

This is on June 11th by LEDinside, LED net and China guangzhou international lighting fair hosted LEDforum2016 China international LED the market trend of the peak on the BBS, bdo, vice President MoQingWei, Chip to titled "the Flip Chip on X (FCoX) - the new architecture, new opportunities, new challenges," the beginning of language.

Vice President MoQingWei, bdo, chip in LEDforum2016 China international peak BBS speech LED the market trend

Inversion of strong growth, the industry is obvious to all. MoQingWei said, according to the turnover of bdo embellish of flip chip, from 2013 onwards, the growth of the dozens of times in recent years, three times the growth in the past couple of years has been maintained, looking forward to is three times that of 2015, 2016, and this growth continues, because there is the discovery of new market and new applications. Strong growth of the market, the on LED technology has changed how?

Flip chip has three big encapsulation structure is two big changes

The first change: early has been in the electrodes and the metal reflector do reflective surface, and in the past year of DBR do reflector technology gradually rise. The DBR technology has been widely used, mainly for the production equipment and formal chip equipment to match, or this would be a good change. DRB is not without its faults, of course, the heat dissipation problem.

Because the DBR is an insulating material, its heat dissipation, high current diffusion ability compared to the metal has some gaps, which also determines the DBR in the next few years concentrated in small size, low power LED, high-power big size will remain metal electrode technology, it is a trend.

The second change is the sustainable development of high-pressure flip chip accepted by the market, more and more customers like high-pressure flip chip products, because they can be directly used to form the ball bubble lamp module.

The third is not so much a change, a rather hard. Before flip chip is concentrated in the blue chips and some green chips, and hope to do in the future is a full spectrum of flip chip, it's need to conquer the yellow light, red light flip chip.

When successful, future full spectrum lighting solutions can be encapsulated with a pretty standard form a full spectrum of the module, it is also a bdo, made in 2016 with the ministry of science and technology in a special key, is a focus on special about LED full spectrum solutions, it will be need us to conquer a technology focus.

Flip chip of the three big changes, also has brought the whole package and module structure changes, mainly reflected in these two aspects.

The first change of architecture, called FcoX (FlipChiponX). As early of standard packaging, can get rid of crystal line, directly on the bracket, can even put the bracket on PCB, can now be achieved. In the light the show can see a lot of related products, like Switzerland abundant FEMC, hon PCT2835, etc. Another architecture is that CSP.

The second is the base plate. The first is the substrate reflectivity, there are a lot of company in providing high reflectivity of the substrate, because there is no stent reflection, it is very important. The second is the substrate of the thermal conductivity, thermal resistance due to the chip itself is very low, and the substrate thermal conductivity is very high, this requires the entire supply chain to solve together.

Finally, the challenge of the CSP more upstream and downstream, or supplier need to provide some more solutions. CSP test, for example, because of its light is a full ambient light, to accurate testing is facing great challenges. Because it is difficult to collect all the light you, although now have the company provides some solutions, but the efficiency is very low, the cost is high, it will be some pain points of the industry.

CSP bring many benefits for size small, at the same time also brings many challenges, like color, brush the take-up and tin, etc. Now there are a lot of special equipment for CSP, once become standardized, I believe that these solutions will be more and more perfect, and also will be more and more low cost, so I think the flip chip industry development should be the whole industrial chain around it as the core, together hand in hand together to create more opportunities.

Which terminal FcoX brought change?

In commercial lighting, visit the light show, see a lot of COB, everyone is talking about narrowing the smooth surface, improve the optical density, suggesting that the commercial lighting light more and more high quality requirements. Not only need to be very clear spot, with secondary optics can very good cooperation, but also need good reliability.

But the person all know, in fact the two are contradictory. Because of the high temperature change, will bring the two failure modes. One is the fracture of crystal line, one is the bursting of silica gel. So in the high-end business, especially in the future to develop in the direction of high power density, flip will behave very competitive.

On the tube, can need not do 2835 tubes, but the chips directly to play on the substrate, fluorescent exist two benefits to do so. One is no support, no gold, can save cost, but a bat, the lamp out, improve production efficiency. The second is a lamp to use 80 80, emitting Angle is 120 degrees, this determines the width of your design, and direct light is 140-140 degree Angle, can use less quantity to achieve such results, images can be no daylight lamp.

In terms of filament lamp, although the benefits of flip chip is limited, but there are still a little benefits, is of high reliability and flexible. Because the flip chip no crystal line, so can be bent to bend, flexible is higher, it will have certain impact on the market, it is also a flip chip on the filament lamp, one of the more interesting applications.

CSP brought what terminal of change?

On the phone flash applications to meizu Pro6 projects, to put it in such a small flash space 10 leds, and it is double color temperature, general technology it's hard to do, and with the CSP can be achieved. And this kind of high density, the advantages of small size also has been applied in many different places.

On the application to shoot the light, put the CSP in a shoot the light, the optical constant, directly to the 15 degrees, and even lower than 15 degrees, this is very popular in the market. Because there is very beautiful, it is to explore the source, or because the size of the packaging is the same as with the size of the chip, optical density is actually very high.

The application of this will be a very hot, and the price is not so sensitive, because get the function of color temperature is dream for many people, especially the high-end shopping center, so the application of CSP under a large CSP will be color temperature.

In car lighting, when the line for day light and turn signal applications, because of small volume, the aesthetic function is the same form, may is line light during the day, it is still the same turn light pipe, this is a high density of impossible before. For matrix headlight, lots of small light source, forming a matrix, can be selectively switch some light, can be avoided according to the front of the car or the left, it is also a CSP application good way in the future.

What are the challenges of the future?

The advantages of flip chip and bring change is endless, but at present there are still some challenges. First is the price, but the good news is that, the past is chip prices decline in slow, and flip chip or increase, this suggests that the gap is closing.

The second is the base plate. The first is the substrate reflectivity, there are a lot of company in providing high reflectivity of the substrate, because there is no stent reflection, it is very important. The second is the substrate of the thermal conductivity, thermal resistance due to the chip itself is very low, and the substrate thermal conductivity is very high, this requires the entire supply chain to solve together.

Finally, the challenge of the CSP more upstream and downstream, or supplier need to provide some more solutions. CSP test, for example, because of its light is a full ambient light, to accurate testing is facing great challenges. Because it is difficult to collect all the light you, although now have the company provides some solutions, but the efficiency is very low, the cost is high, it will be some pain points of the industry.

CSP bring many benefits for size small, at the same time also brings many challenges, like color, brush the take-up and tin, etc. Now there are a lot of special equipment for CSP, once become standardized, I believe that these solutions will be more and more perfect, and also will be more and more low cost, so I think the flip chip industry development should be the whole industrial chain around it as the core, together hand in hand together to create more opportunities.