Keywords: LED industry
Summary - the LED in the rapid development, in this process will appear constantly s-shaped curve in the development of technology. All kinds of technology of alternating change happen every time, only the disruptive technology development dynamic, can be built to last.
The definition of disruptive technologies:
1, simpler, cheaper, and lower performance. (especially when it first came out, and continue for a period of time)
2, margin usually lower, also won't achieve higher profits.
3, leading enterprise customers usually don't use can bring the biggest profit, also will not be accepted.
4, in the first place in the emerging markets, or not important on the market, put into commercial operation.
What happens to the LED industry may be disruptive technologies are:
Chip: flip chip, high voltage chip
Encapsulation stents: EMC
Packaging forms: COB and CSP
Power supply: linear constant current IC
Radiator: plastic bag aluminum shell
Crossover: light engine
A, high voltage chip:
LED itself is a kind of disruptive technologies, after decades of development finally can walk into the mainstream of lighting on the market, to shine. LED the whole industry chain of each link in the technological innovation constantly, chip, there are many kinds of product innovation, in all kinds of high pressure the chips may be disruptive technologies. Originally each chip only a p-n junction area, high voltage chip to multiple PN collected into on the same chip, a series process for integration. So the single chip can have different regular voltage, depending on the amount of the p-n junction area integration and get a higher voltage. The use of high pressure chip can reduce packaging plant operation time, used to fixed more than chips, now you just need to a high voltage chip. Even in high voltage chip when entering the market, the metal bridge area breakdown, easy to produce the phenomenon such as photosynthetic efficiency low are in line with the typical features of disruptive technologies: performance is worse than the original, is not easy in a major marketing. Entering the market can only be the ball bubble lamp and other LED quantity is less, the occasion of high voltage. With the progress of high voltage chip, has extended to the field of commercial lighting tube lamp, absorb dome light, such as more lucrative market.
Flip chip in LED industry appears the time is not long, does not belong to disruptive technologies in terms of its technical characteristics. Flip chip in traditional semiconductor industry for longer periods of time, the reliability of flip chip, heat resistance stronger. Currently in LED industry due to the structural characteristics of photosynthetic efficiency index on the low side. The future when the LED lighting levels tend to limit, the user will preference to reliability of preference, from a performance is the time when the flip chip puts glorious greatly. Although flip chip does not belong to disruptive technologies, flip chip to match other technologies can form disruptive technologies.
Second, EMC support material
LED encapsulation stents have experienced all kinds of technical change, from PPA to PCT to the transition of EMC scaffold was partly due to the LED using the environment temperature is higher and higher temperature resistance of scaffold materials demand is higher and higher. But from another perspective, the emergence of EMC material is to change the PPA and PCT? EMC stents in relative to the PPA and PCT is the progress of performance, but for ceramic bracket is disruptive technologies, although there are brittle shortcomings, such as when they first appeared. For EMC stents cooling capacity at present, in a single star power 1 ~ 5 w can completely replace the ceramic bracket (3535 substrate size, for example), EMC materials used in the lighting industry is a special market in order to enter the higher order (mainly use ceramic substrate market). With the expanding of EMC bracket light source device size, in 1 ~ 15 w light source type of lamps and lanterns can be directly using a light source device of EMC support to complete the whole lamp design, to facilitate the design of lamps and lanterns. EMC single light source device coupled with aluminum plate, can completely replace 1 ~ 15 w COB products. When EMC devices after validation of the lighting market, will enter the ceramic substrate devices now in general use in market, such as automotive electronics and medical electronics and other more lucrative market.
Three, COB and CSP packaging format
From the point of packaging form, discrete devices and integrated devices are always parallel to replace each other, to say the strengths, in the cross of COB products on the market is a disruptive technology innovation. COB products appear single LED device with low power, high power to do more than the LED products should be pasted on. And in the light output of high density applications, due to the bracing of the single star device area and patch spacing increases the whole area, causing light flux density is low. The formation of the COB can easily more highlights on the output characteristics. So the COB products perfect in the field of shoot the lamp to replace a single device. COB products in market promotion stage is also after the ball bubble lamp in a low profit space, to the canister light, shoot the lamp to development, has become the mainstream of commercial lighting lamps and lanterns light source.
CSP packaging form, the CSP in LED industry appeared is called disruptive technologies, no gold, no substrate, "packaging" of encapsulation. This destructive innovation for the packaging industry are destructive. CSP is not, however, LED industry characteristic product. CSP products originally appeared on the traditional semiconductor packaging device (traditional semiconductor to the development trend of miniaturization, development to a certain degree of encapsulation device the size of the chip is the size of 1.2 times is defined as a CSP). Collocation of CSP products enter into the LED industry for flip chip, no need to use encapsulated device bracket, it didn't appear without foundation plate this characteristic, caused the attention of the industry. CSP products have all the characteristics of disruptive technologies, poor performance, light color uneven lighting, SMD difficulty is higher, these technical problems as more corporate r&d breakthrough, will be overcome. Just now still find belongs to own a particular niche market.
Fourth, linear constant current IC
The power industry: linear constant current IC. The traditional drive power supply requires many IC protection of peripheral components. Linear constant current IC will all kinds of protection components integrated together to form a single integrated IC. Each IC can be on the lamps and lanterns of LED driver. Although marketed in time met such as: input voltage range (to ensure constant current) plus or minus 10%, beyond the scope will be brightness adjustment (current); Increase the capacitance can dispel stroboscopic, but power by numerical lowers; Heat is relatively concentrated, the overall improve heat dissipation capacity requirements for the whole lamp; Can't give attention to both efficiency and power factor index, but can only choose one. Dimming performance is segmented dimmer, can't adjust current shortcomings, such as a whole, but through various IC practitioners of hard research and development, through the tempering of low power market, linear IC is about to enter the mainstream market.
Five, plastic package aluminum shell
Lamps and lanterns: plastic bag aluminum radiator. The emergence of the plastic bag aluminum shell suite first is due to the LED light efficiency is higher and higher, temperature tolerance is getting better and better, requirements for heat dissipation is not so demanding; Second is the result of the development of the plastic material itself, plastic and heat exchange of air faster and faster. Once again, the improvement of injection molding process can be very good to very good aluminum and plastic materials together. For lamps and lanterns plastic package aluminum material lighter and better withstand voltage characteristics. Began to appear again when the ball steep light field, has been into the canister light field of commercial lighting, etc.
Six, light engine
Crossover: the light engine. Light source module component products, promoting IC integration products, system integration, modularization, modular become one of the developing direction in the field of packaging. Main lamp bead and power LED packaging enterprises integrated form optical engine, installed on the lamps can be used directly, use more convenient and quick. Enterprise need not match the lamp bead and power supply of lamps and lanterns has designed various certification required creepage distance and safety requirements, using the characteristics of the light engine can meet the certification requirements.
LED in the rapid development, in the process will appear constantly s-shaped curve in the development of technology. All kinds of technology of alternating change happen every time, only the disruptive technology development dynamic, can be built to last. The development of technology always follow the direction of performance, reliability and convenience, identify trends can better understand the innovation of technology.
