In the whole chip foundries only 7 nm advanced process actively, all want to in the field of 7 nm process had dragon throne, three camps TSMC (TSMC), samsung, and assistance from IBM's Romania DE (fab), who will eventually, the result will affect the ecology of global semiconductor market.

In 2016, according to foreign media, said: the mainstream of wafer foundry process is 14 and 16 nm FinFET process, its main industry contains Intel (Intel), TSMC and samsung/Romania's three big camp, and extended to the field the next generation of 10 nm advanced process, also the three major groups are announced in 2017. However, due to 10 nm process mainly for production of low power mobile chips. Therefore, a more advanced generation 7 is considered to be the first time only 10 nano limit high-performance advanced process, and is also the focus of the three parties compete for.

Currently, TSMC and samsung are poised to 7 nm advanced process on the beat, and, in the absence of the earlier of Romania, decided to put this time back to disadvantage, vowed to lead in 7 nm process. However, in the past 14 and 10 nano has involved in Intel, in 7 nm process are said to be cautious. Because to compete with TSMC and samsung more than three generation process, makes Intel 7 nm process until at least 2020 years to have the opportunity to mass production. However, relative to the Intel, samsung and TSMC is positive.

Shortly before the part of samsung, the investment of money to buy the EUV lithography, hope in 2 to 7 nm process began in 2017, TSMC is commented by CEO mark liu pointed out that 7 nm process of SRAM yield is 30% to 30%, will be the industry's first through 7 nm process certification of the semiconductor company. As for, the past in the age of 14 nm process behind samsung and TSMC's Romania, is to give up their own research and development of 14 nm process technology, changed in favour of samsung 14 nm FinFET process technology licensing. However, in 2014, bought IBM's business of fabs, Romania's hope to play catch-up, the number one in 7 nm process.

According to understand, Romania, in the acquisition of IBM's fabs won a large number of experienced staff, in business it is very helpful to promote research and development of new process. And, in July 2015, Romania's joint, IBM, samsung, and the state university of New York has pioneered the 7 nm process, makes in wafer Romania's gradually become a force to be reckoned with in the OEM business. By Romania's CTO, senior vice general manager Gary Patton said that their 7 nm process progress has positive reduced the threshold of the new process.

Patton said, at present, Romania, in the city of New York Malta fabs are 14 nm process mass production, it laid a solid foundation for them to develop more advanced technology. For the 7 nm process, Patton said even without EUV process, their new process can decrease the cost of a wafer. According to Patton is expected, Romania's EUV process is expected to be a small amount of production in 2018 or 2018, and formally in 2020.